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TTM Technologies, Inc., together with its subsidiaries, manufactures and sells mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and printed circuit boards (PCB) worldwide. The company operates in two segments, PCB and RF&S Components. It offers range of engineered systems, RF and microwave assemblies, HDI PCBs, flexible PCBs, rigid-flex PCBs, custom assemblies and system integration, IC substrates, passive RF components, advanced ceramic RF components, hi-reliability multi-chip modules, beamforming and switching networks, PCB products, RF components, and backplane/custom assembly solutions, including conventional PCBs. It also provides advanced ceramic RF components including standard and etched thick-film ceramic substrates; and hi-reliability multi-chip modules. In addition, the company offers radar systems including maritime surveillance and weather avoidance radar systems, surveillance products, communication systems, RF assembly and test services, and passive RF components. Further, the company provides custom designed application specific integrated circuits, high density interconnect, IC substrates, flexible and rigid flex PCBs, and custom assemblies including backplane and mid-plane assemblies, flexible and rigid-flex assemblies, and RF assemblies, as well as conventional PCBs, such as single-sided, double-sided, and multi-layer boards. Additionally, it offers quick turnaround services, which includes prototype production and ramp-to-volume production, and thermal management. The company serves original equipment manufacturers and electronic manufacturing services providers, original design manufacturers, distributors, and government agencies; and aerospace and defense, data center computing, automotive, medical, industrial, and instrumentation, as well as networking applications. TTM Technologies, Inc. was incorporated in 1978 and is headquartered in Santa Ana, California.
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A unique technical analysis driven score developed by Kalkine showing momentum in stock prices based on select technical indicators identified.
TTM Technologies manufactures printed circuit boards, backplane assemblies and provides electronic manufacturing services for communications, computing, industrial, automotive and aerospace/defense customers. Long-term growth may be supported by trends like 5G, data-center expansion and automotive electrification, and the company's scale and advanced PCB capabilities appear positioned to capture higher-value work.
Principal risks include cyclical electronics demand, customer concentration, margin pressure from low-cost competitors, raw-material and supply-chain volatility, and geopolitical exposure from a global manufacturing footprint.
Note: The summary and risk score provided above is created by AI and should not be construed as a recommendation of Kalkine.
| Breakdown | 2022-12-31 | 2021-12-31 | 2020-12-31 | 2019-12-31 | 2018-12-31 |
|---|---|---|---|---|---|
| Type | yearly | yearly | yearly | yearly | yearly |
| Date | 2022-12-31 | 2021-12-31 | 2020-12-31 | 2019-12-31 | 2018-12-31 |
| Income before tax | 182.86M | 70.05M | -46.28M | 46.18M | 89.77M |
| Minority interest | - | - | - | 0.00M | 0.00M |
| Net income | 94.58M | 54.41M | -16.39M | 41.30M | 173.58M |
| Selling general administrative | 158.18M | 124.86M | 122.48M | 152.10M | 159.44M |
| Selling and marketing expenses | 75.18M | 63.02M | 63.88M | 74.01M | 73.31M |
| Gross profit | 457.96M | 372.01M | 359.02M | 401.68M | 457.03M |
| Reconciled depreciation | 37.10M | 35.75M | 166.13M | 219.87M | 225.73M |
| Ebit | 210.41M | 125.99M | 112.84M | 120.12M | 174.24M |
| Ebitda | 217.77M | 170.74M | 151.68M | 184.87M | 233.93M |
| Depreciation and amortization | 7.36M | 44.75M | 38.84M | 64.75M | 59.68M |
| Non operating income net other | 17.97M | -10.46M | - | 9.30M | 9.64M |
| Operating income | 210.41M | 125.99M | 112.84M | 120.12M | 159.09M |
| Other operating expenses | 2332.35M | 2118.50M | 1991.27M | 2562.21M | 2682.66M |
| Interest expense | 45.52M | 45.48M | 73.16M | 83.23M | 78.96M |
| Tax provision | 88.28M | 15.64M | -29.89M | 4.88M | -83.82M |
| Interest income | - | - | - | - | 78.96M |
| Net interest income | -45.52M | -45.48M | -73.16M | -83.23M | -78.96M |
| Non recurring | 4.09M | 4.25M | - | 6.98M | 5.52M |
| Income tax expense | 88.28M | 15.64M | -29.89M | 4.88M | -83.82M |
| Total revenue | 2495.05M | 2248.74M | 2105.32M | 2689.31M | 2847.26M |
| Total operating expenses | 295.27M | 241.78M | 244.97M | 274.58M | 292.43M |
| Cost of revenue | 2037.08M | 1876.73M | 1746.30M | 2287.62M | 2390.23M |
| Total other income expense net | -27.55M | -55.94M | -159.12M | -73.94M | 4.12M |
| Discontinued operations | - | - | 193.92M | 193.92M | 193.92M |
| Net income from continuing ops | 94.58M | 54.41M | -16.39M | 41.30M | 173.58M |
| Net income applicable to common shares | 94.58M | 54.41M | 177.53M | 41.30M | 173.58M |
| Breakdown | 2023-12-31 | 2022-12-31 | 2021-12-31 | 2020-12-31 | 2019-12-31 |
|---|---|---|---|---|---|
| Type | yearly | yearly | yearly | yearly | yearly |
| Date | 2023-12-31 | 2022-12-31 | 2021-12-31 | 2020-12-31 | 2019-12-31 |
| Total assets | 3323.66M | 3323.60M | 3025.55M | 2895.94M | 3560.93M |
| Intangible assets | 236.71M | 288.04M | 239.92M | 281.31M | 332.01M |
| Other current assets | 54.06M | 110.66M | 30.91M | 27.18M | 1220.66M |
| Total liab | 1812.62M | 1788.03M | 1570.13M | 1451.93M | 2281.90M |
| Total stockholder equity | 1511.04M | 1535.58M | 1455.42M | 1444.01M | 1279.04M |
| Deferred long term liab | - | 0.79M | 1.35M | 1.92M | 2.51M |
| Other current liab | 230.15M | 238.19M | 175.41M | 190.94M | 209.29M |
| Common stock | 0.11M | 0.11M | 0.11M | 0.11M | 0.11M |
| Capital stock | 0.11M | 0.11M | 0.11M | 0.11M | 0.11M |
| Retained earnings | 782.12M | 800.84M | 706.26M | 651.84M | 474.31M |
| Other liab | - | 121.47M | 84.16M | 91.04M | 80.68M |
| Good will | 702.74M | 760.44M | 637.32M | 637.32M | 774.79M |
| Other assets | - | 39.01M | 3025.55M | 27.18M | 64.36M |
| Cash | 450.21M | 402.75M | 537.68M | 451.56M | 400.15M |
| Total current liabilities | 703.98M | 761.33M | 558.15M | 518.05M | 946.67M |
| Current deferred revenue | 126.51M | 103.98M | 14.19M | 4.25M | 3.84M |
| Net debt | 570.43M | 559.85M | 426.77M | 391.29M | 1092.30M |
| Short term debt | 12.71M | 57.37M | 7.06M | -4.25M | 249.97M |
| Short long term debt | 3.50M | 50.00M | - | - | 249.97M |
| Short long term debt total | 1020.63M | 962.60M | 964.45M | 842.85M | 1492.45M |
| Other stockholder equity | 757.87M | 759.42M | 776.31M | 830.97M | 814.71M |
| Property plant equipment | - | 724.20M | 686.56M | 650.43M | 1022.93M |
| Total current assets | 1429.69M | 1493.06M | 1407.41M | 1221.58M | 1342.68M |
| Net tangible assets | - | 487.11M | 1455.42M | 525.38M | 172.24M |
| Short term investments | 3.25M | - | - | - | 0.00M |
| Net receivables | 712.34M | 878.25M | 711.21M | 654.36M | 791.90M |
| Long term debt | 914.34M | 879.41M | 927.82M | 842.85M | 1225.96M |
| Inventory | 213.07M | 170.64M | 127.61M | 115.65M | 122.02M |
| Accounts payable | 334.61M | 361.79M | 361.48M | 327.10M | 483.57M |
| Accumulated other comprehensive income | -29.07M | -24.79M | -27.25M | -38.91M | -10.09M |
| Common stock total equity | - | 0.11M | 0.11M | 0.11M | 0.11M |
| Retained earnings total equity | - | 800.84M | 706.26M | 651.84M | 474.31M |
| Non currrent assets other | 168.13M | 39.01M | 54.34M | 53.78M | 64.36M |
| Non current assets total | 1893.98M | 1830.55M | 1618.13M | 1647.19M | 2218.25M |
| Capital lease obligations | 102.02M | 33.20M | 36.63M | 17.21M | 16.52M |
| Long term debt total | - | 879.41M | 927.82M | 842.85M | 1225.96M |
| Breakdown | 2022-12-31 | 2021-12-31 | 2020-12-31 | 2019-12-31 | 2018-12-31 |
|---|---|---|---|---|---|
| Type | yearly | yearly | yearly | yearly | yearly |
| Date | 2022-12-31 | 2021-12-31 | 2020-12-31 | 2019-12-31 | 2018-12-31 |
| Investments | -395.46M | -3.19M | 404.29M | -135.97M | -746.19M |
| Change to liabilities | 33.94M | 23.65M | -26.38M | 25.50M | -76.23M |
| Total cashflows from investing activities | -395.46M | -84.14M | 404.29M | -135.97M | -746.19M |
| Net borrowings | - | 494.04M | -649.98M | -1.81M | 322.37M |
| Total cash from financing activities | -11.31M | -7.23M | -642.31M | -31.81M | 321.06M |
| Change to operating activities | 33.27M | -22.32M | -31.04M | -14.75M | -25.29M |
| Net income | 94.58M | 54.41M | 177.53M | 41.30M | 173.58M |
| Change in cash | -134.93M | 86.11M | 51.41M | 143.79M | -152.97M |
| Begin period cash flow | 537.68M | 451.56M | 400.15M | 256.36M | 409.33M |
| End period cash flow | 402.75M | 537.68M | 451.56M | 400.15M | 256.36M |
| Total cash from operating activities | 272.87M | 176.63M | 287.18M | 311.94M | 273.14M |
| Depreciation | 133.91M | 127.33M | 166.13M | 219.87M | 225.73M |
| Other cashflows from investing activities | -292.57M | 1.00M | 507.58M | 6.60M | -596.07M |
| Dividends paid | - | -2.27M | - | - | - |
| Change to inventory | -4.41M | -11.96M | 1.38M | -12.64M | 18.25M |
| Change to account receivables | -35.74M | -5.24M | 122.55M | 19.50M | 1.37M |
| Sale purchase of stock | -35.42M | -64.73M | -64.73M | - | 0.19M |
| Other cashflows from financing activities | 73.52M | 483.33M | 7.67M | -1.80M | 614.04M |
| Change to netincome | 23.85M | 33.02M | -143.36M | 2.22M | -81.40M |
| Capital expenditures | 102.88M | 81.95M | 103.29M | 142.58M | 150.13M |
| Change receivables | -35.74M | -5.24M | 122.55M | 19.50M | 1.37M |
| Cash flows other operating | 158.50M | 80.64M | 138.00M | 55.22M | 60.16M |
| Exchange rate changes | - | - | - | - | -0.97M |
| Cash and cash equivalents changes | -133.90M | 85.26M | 49.16M | 144.15M | -152.97M |
| Change in working capital | 18.39M | -40.25M | 69.42M | 34.28M | -59.47M |
| Stock based compensation | 19.52M | 17.71M | 16.07M | 16.82M | 20.68M |
| Other non cash items | -54.83M | 7.68M | -148.63M | 12.12M | 10.90M |
| Free cash flow | 169.99M | 94.68M | 183.89M | 169.36M | 123.01M |
Sector: Technology Industry: Electronic Components
|
Stock Name
|
Change
(USD) |
Price
(USD) |
Trailing
PE (x) |
Forward
PE (x) |
Price Sales
TTM (x) |
Price to Book Value (x)
|
Enterprise Value
to Revenue (x) |
Enterprise Value
to EBITDA (x) |
|---|---|---|---|---|---|---|---|---|
| TTMI TTM Technologies Inc |
-3.16 3.48% |
87.63 | - | - | 0.65 | 0.97 | 0.91 | 9.70 |
| APH Amphenol Corporation |
1.12 1.38% |
82.08 | 45.49 | 34.25 | 8.09 | 13.93 | 8.26 | 27.70 |
| GLW Corning Incorporated |
-2.32 1.77% |
128.88 | 89.92 | 53.19 | 9.09 | 12.03 | 9.59 | 40.14 |
| HNHPF Hon Hai Precision Industry Co Ltd ADR |
-0.23 1.49% |
15.25 | 16.20 | 11.34 | 0.01 | 1.82 | 0.35 | 6.73 |
| MRAAF Murata Manufacturing Co. Ltd |
2.94 7.08% |
44.50 | 59.07 | 33.56 | 0.05 | 4.71 | 6.76 | 25.24 |
TTM Technologies, Inc., together with its subsidiaries, manufactures and sells mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and printed circuit boards (PCB) worldwide. The company operates in two segments, PCB and RF&S Components. It offers range of engineered systems, RF and microwave assemblies, HDI PCBs, flexible PCBs, rigid-flex PCBs, custom assemblies and system integration, IC substrates, passive RF components, advanced ceramic RF components, hi-reliability multi-chip modules, beamforming and switching networks, PCB products, RF components, and backplane/custom assembly solutions, including conventional PCBs. It also provides advanced ceramic RF components including standard and etched thick-film ceramic substrates; and hi-reliability multi-chip modules. In addition, the company offers radar systems including maritime surveillance and weather avoidance radar systems, surveillance products, communication systems, RF assembly and test services, and passive RF components. Further, the company provides custom designed application specific integrated circuits, high density interconnect, IC substrates, flexible and rigid flex PCBs, and custom assemblies including backplane and mid-plane assemblies, flexible and rigid-flex assemblies, and RF assemblies, as well as conventional PCBs, such as single-sided, double-sided, and multi-layer boards. Additionally, it offers quick turnaround services, which includes prototype production and ramp-to-volume production, and thermal management. The company serves original equipment manufacturers and electronic manufacturing services providers, original design manufacturers, distributors, and government agencies; and aerospace and defense, data center computing, automotive, medical, industrial, and instrumentation, as well as networking applications. TTM Technologies, Inc. was incorporated in 1978 and is headquartered in Santa Ana, California.
| Name | Title | Year Born |
|---|---|---|
| Mr. Thomas T. Edman | Pres, CEO & Director | 1962 |
| Mr. Todd B. Schull | Exec. VP & CFO | 1959 |
| Mr. Philip Titterton | Exec. VP & COO | 1966 |
| Mr. Daniel J. Weber | Exec. VP, Gen. Counsel & Corp. Sec. | 1972 |
| Mr. Douglas L. Soder | Exec. VP & Pres of Commercial Sector | 1961 |
| Sameer Desai | VP of Corp. Devel. & Investor Relations | NA |
| Mr. O. Clay Swain | Sr. VP of Marketing | 1964 |
| Mr. William Kent Hardwick | Sr. VP of Global Sales & EMS | NA |
| Mr. Shawn Powers | Exec. VP & Chief HR Officer | NA |
| Mr. Dale Knecht | Sr. VP of Global Information Technology | NA |
Disclaimer - (*)This information, including any data, is sourced from Unicorn Data Services SAS, trading as EOD Historical Data (“EODHD”) on an ‘as is’ basis, using their API. We cannot guarantee the completeness or validity of the information and data provided on this page, as well as via the API. In some cases, the data may include analyst ratings or recommendations sourced through the EODHD API, which are intended solely for general information purposes.
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