Tower Semiconductor Ltd. filed a Form 6-K on November 3, 2026, disclosing a press release announcing the company's continued collaboration with Innolight on Near-Package Optics development for AI infrastructure.

Key Highlights

  • First NPO device in early production: Innolight's first Near-Package Optics device has entered early production using Tower's PH18M Silicon Photonics process flow running in Tower's US CA factory, according to the filing.
  • 300mm tapeouts completed: Innolight has taped-out multiple NPO products on Tower's 300mm Silicon Photonics platform to support future product generations, the filing states.
  • Dual platform manufacturing: The collaboration leverages Tower's high-volume 200mm and 300mm Silicon Photonics manufacturing platforms.
  • Four-facility customer: The filing quotes Dr. Marco Racanelli, President of Tower Semiconductor, describing Innolight as a "cornerstone manufacturing customer now across four of our facilities, two in the US (Newport Beach California and San Antonio Texas) and one each in Israel and Japan."
  • High channel count requirements: According to the filing, NPO architectures "typically require substantially higher optical channel counts than conventional pluggable optical modules, often integrating 16 or more channels on a single device."

Tower and Innolight Collaboration on Near-Package Optics Manufacturing

Tower Semiconductor (NASDAQ:TSEM), filing under Form 6-K for the month of November 2026, disclosed through a press release that it and Innolight are advancing their collaboration on Near-Package Optics (NPO) applications aimed at AI and cloud infrastructure. According to the filing, the collaboration combines Innolight's optical interconnect expertise with Tower's Silicon Photonics manufacturing capabilities across both 200mm and 300mm platforms.

The filing reports that Innolight achieved what it described as "a key milestone" with its first NPO device entering early production using Tower's PH18M Silicon Photonics process at Tower's US CA facility. In parallel, the filing states, Innolight has taped-out multiple NPO products on Tower's 300mm Silicon Photonics platform to address future product generations. The filing notes that NPO architectures are "emerging as one of the preferred approaches for next-generation optical interconnects" as AI workloads scale, and that these architectures are expected to drive additional demand beyond the pluggable optical module market.

The filing quotes Oliver Sun, CTO of Innolight, stating that the collaboration with Tower "provides us with industry leading capabilities enabling us to accelerate the development of NPO solutions to meet the evolving needs of hyperscale and AI data center customers." Tower's platform, the filing explains, enables monolithic integration of multiple photonic functions, including wavelength division multiplexing and demultiplexing on a single chip. The filing also notes Tower's global manufacturing network spans fabs in Israel, the U.S., Japan, and Italy. This press release contains forward-looking statements that, according to the filing's own cautionary language, "are subject to risks and uncertainties" and "actual results may vary."

What Was Disclosed

Tower Semiconductor disclosed, via a Form 6-K dated November 3, 2026, a press release describing an advanced manufacturing collaboration with Innolight on Near-Package Optics, including Innolight's first NPO device entering early production on Tower's PH18M process at a U.S. facility.